Features

1. Etching line width/distance: 3mil/3mil

2. Etching evenness C.O.V ≥ 92%

3. Etching factor ≥ 3.5

4. The precision etching design effectively controls the puddle effect, thereby improving the evenness of the panel.

5. In the film stripping process, a sprinkle system, dose circulation system, and a uniquely designed dreg collection system are employed to achieve a dreg removal rate of up to 98 percent.

Procedure

Load → Film stripping → Water rinse → Etching → Water rinse → De-Palladium → Water rinse → Tin Stripping → Water rinse → Scrubbing → Water rinse→ Drying Module → Unload