This equipment is used for removing the plugging resin from the vias in the PCB substrates and for surface treatment tasks following copper plating.

Features

1. The specially designed body structure demonstrates superior performance in absorbing vibration and noise.

2. It targets at work pieces whose thickness come between 0.1 – 3.2 mm.

3. It can automatically measure the board thickness and regulate pressure accordingly.

4. Grinding brushes can be replaced within 5 minutes.